Lead Free Solders

Lead Free Solders

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Leveraging on a skilled workforce and ethical business policies, we are able to supply a wide range of Lead Free Solders. Made of high quality raw materials, these products provide accurate and optimum performance. We have trustworthy vendor base who provide us with these qualitative products. Known among the clients for their longer service life, less maintenance, non-corrosive surface and effective functioning, these products have a huge demand in the market. Lead Free Solders are delivered to the clients in a stipulated time frame owing to our wide distribution network.

SHENMAO / PAI Lead Free Solder

Alloy No. Alloy Composition Melting point (°C) Product Gravity Strength (Kgf/mm) Elongation (%) Remark

Bar Sphere Wire Paste

SP601 Sn-Ag2.5-Cu0.5 220°C O O O
7.40 5.3 57 Medium temperature alloy
SP602 Sn-Bi58 13tfC O O O O 8.56 7.8 27 Low temperature alloy
SP603 + Sn-Ag3.5 221°C 0 o O O 7.36 4.18 58 Soldering rework use
SP604 * Sn-Cu0.7 227"C o O O
7.32 3.80 50 Wave soldering & rework
SP6O5 Sn99.95 232°C o O O
7.28 2.20 55 Medium temperature alloy
*SP6O6 + Sn-Ag3.0-Cu0.5 219t; o o O o 7.40 5.30 47 Medium temperature alloy
*SP607 Sn-Ag3.5-Cu0.7 217t; o o O o 7.42 5.34 48 Medium temperature alloy
SP608 Sn-Ag3.9-Cu0.6 217t o o O o 7.42 5.34 48 Medium temperature alloy
SP6O9 Sn-Ag3.8-CuO.7 217t 0 0 O o 7.42 5.34 48 Medium temperature alloy
**SP610+ Sn-Ag3.O-CuO.5-NiO.O6- GeO.Ol 219t o o O o 7.40 5.40 48 Medium temperature alloy
SP614 Sn-Ag4.0-Cu0.5 217°C o o O o 7.42 5.34 48 Medium temperature alloy

*U.S. Patent No. 5.527.628
**PF610 A This is our alloy composition to recommend "Sn-Ag-Cu" system1 C

  • Japanese Patent No. 3296289 C U.S Patent No. 6179935B1
  • We also manufacture Solder with Alloy Composition Sn97-CuO3
  • Alloy No. SP604 can be supplied with addition of Ag, Ni, Ge