PAI Lead Free Solder Paste
PAI Lead Free Solder Paste
We also provide lead free micro solder paste for flip chip process.
Approx.: Rs 4,315 Per Kilogram
Product Details:
| Brand | Sharang |
| Weight | 11 g |
| Material Composition | Sn63/Pb 37 |
| Material Type | Paste |
The Solder Paste offered by us is used in soldering applications in various industries such as electrical, electronics and others. Developed using the advanced technology by OEMs, this paste is suitable for low-temperature and high-temperature reflow. This paste is lead-free and ideal for gap filling and on vertical surfaces application.
| Shenmao / pai lead free solder paste Sn-Ag-Cu (SAC) Series | ||||||
| Item/Product | SP606-P | SP607-P | SP608-P | SP609-P | SP610-P | SP614-P |
| Alloy | Sn/Ag3.0Cu0.5 | Sn/Ag3.5/Cu0.7 | Sn/Ag3.9/Cu0.6 | Sn/Ag3.8/Cu0.7 | Sn/Ag3.0/Cu0.5/ Ni0.06/Ge0.01 | Sn/Ag4.0/Cu0.5 |
| Melting Point (°C) | 217-219 | 217-219 | 217-219 | 217-219 | 217-219 | 217-219 |
| Particle Sixe (um) | 20-45 ,20-38 | 20-45,20-38 | 20-45 ,20-38 | 20-45,20-38 | 20-45 ,20-38 | 20-45 , 20-38 |
| Flux Content (%) | 11+/-0.5 | 11+/-0.5 | 11+/-0.5 | 11+/-0.5 | 11+/-0.5 | 11+/-0.5 |
| Flux Type | R0L1 | R0L1 | R0L1 | R0L1 | R0L1 | R0L1 |
| Halide content(%) | 0.05 | 0.05 | 0.05 | 0.05 | 0.05 | 0.05 |
| Fluoride | None | None | None | None | None | None |
| Viscosity (Pa.s) | 200+30 | 200+30 | 200+30 | 200+30 | 200+30 | 200+30 |
| Spread(%) | 80 | 80 | 80 | 80 | 80 | 80 |
| Tackiness (gf) | 140 | 140 | 140 | 140 | 140 | 140 |
| Corrosion | PASS | PASS | PASS | PASS | PASS | PASS |
| S.I.R | > 1 x 109 | > 1 x 109 | > 1 x 109 | > 1 x 109 | > 1 x 109 | > 1 x 109 |
| Electro Migration | PASS | PASS | PASS | PASS | PASS | PASS |