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Lead Free Solders
Lead Free Solders
Price And Quantity
- 1
- Kilograms/Kilograms
- 1 INR
- 1.00 - 1.00 INR
Product Description
Leveraging on a skilled workforce and ethical business policies, we are able to supply a wide range of Lead Free Solders. Made of high quality raw materials, these products provide accurate and optimum performance. We have trustworthy vendor base who provide us with these qualitative products. Known among the clients for their longer service life, less maintenance, non-corrosive surface and effective functioning, these products have a huge demand in the market. Lead Free Solders are delivered to the clients in a stipulated time frame owing to our wide distribution network.
SHENMAO / PAI Lead Free Solder
| Alloy No. | Alloy Composition | Melting point (C) | Product | Gravity | Strength (Kgf/mm) | Elongation (%) | Remark | |||
| | | | Bar | Sphere | Wire | Paste | | | | |
| SP601 | Sn-Ag2.5-Cu0.5 | 220C | O | O | O | | 7.40 | 5.3 | 57 | Medium temperature alloy |
| SP602 | Sn-Bi58 | 13tfC | O | O | O | O | 8.56 | 7.8 | 27 | Low temperature alloy |
| SP603 + | Sn-Ag3.5 | 221C | 0 | o | O | O | 7.36 | 4.18 | 58 | Soldering rework use |
| SP604 * | Sn-Cu0.7 | 227"C | o | O | O | | 7.32 | 3.80 | 50 | Wave soldering & rework |
| SP6O5 | Sn99.95 | 232C | o | O | O | | 7.28 | 2.20 | 55 | Medium temperature alloy |
| *SP6O6 + | Sn-Ag3.0-Cu0.5 | 219t; | o | o | O | o | 7.40 | 5.30 | 47 | Medium temperature alloy |
| *SP607 | Sn-Ag3.5-Cu0.7 | 217t; | o | o | O | o | 7.42 | 5.34 | 48 | Medium temperature alloy |
| SP608 | Sn-Ag3.9-Cu0.6 | 217t | o | o | O | o | 7.42 | 5.34 | 48 | Medium temperature alloy |
| SP6O9 | Sn-Ag3.8-CuO.7 | 217t | 0 | 0 | O | o | 7.42 | 5.34 | 48 | Medium temperature alloy |
| **SP610+ | Sn-Ag3.O-CuO.5-NiO.O6- GeO.Ol | 219t | o | o | O | o | 7.40 | 5.40 | 48 | Medium temperature alloy |
| SP614 | Sn-Ag4.0-Cu0.5 | 217C | o | o | O | o | 7.42 | 5.34 | 48 | Medium temperature alloy |
*U.S. Patent No. 5.527.628
**PF610 A This is our alloy composition to recommend "Sn-Ag-Cu" system1 C
- Japanese Patent No. 3296289 C U.S Patent No. 6179935B1
- We also manufacture Solder with Alloy Composition Sn97-CuO3
- Alloy No. SP604 can be supplied with addition of Ag, Ni, Ge
Trade Information
- Cash in Advance (CID), Cheque
- Within 1-2 weeks Week
- All India
Contact Us
Pune Bombay Road, Dapodi, Pune, Maharashtra, 411012, India
Phone :32417448
